The PhableS is a step-and-repeat lithography tool designed for larger wafer sizes, such as 200 mm, 300 mm, and beyond. Using the large exposure fields of displacement Talbot lithography (DTL), the PhableS tool can fill larger substrates with multiple exposures. This tool is equipped with automated wafer and mask handling within a particle-controlled environment, ideal for high-volume industrial production. It features a variable exposure field size, allowing selective printing across multiple device masks.
| Parameter | UV | DUV |
|---|---|---|
| Resolution (linear grating) | <125 nm | <65 nm |
| Wafer size | 300 mm; larger size on request |
|
| Mask format | 6″ | |
| Illumination uniformity | <3% | |
| Resist thickness | >1 µm | >0.1 µm |
| Operation | Automated wafer and mask handling, factory interface compatible | |
| Overlay alignment | <1 µm frontside, < 5µm backside | |
| Duty cycle control | Variable compatible; At 150 nm pitch: 0.4 to 0.65 DC At 300 nm pitch: 0.3 to 0.75 DC |
|
| Throughput | 40 WPH | |
| Maximum Exposure Field Size | 140 mm x 140 mm | |
Download the product flyer for the full specification.
Download the product flyer for the full specification.
